ELECTRICAL ENGINEERING / CITYU HONG KONG電氣工程 / 香港城市大學

Kahung He 何嘉鴻何嘉鴻 Kahung He

I am an electrical engineering undergraduate at City University of Hong Kong. My work spans embedded systems, electronic design, mechanical prototyping, and software development.現於香港城市大學修讀電氣工程本科,實作領域包括嵌入式系統、電子設計、機械原型及軟件開發。

CityU Hong Kong · Expected graduation 2027香港城市大學 · 預計 2027 年畢業 Technical profile技術概覽

01 / PROJECTS項目

Portfolio作品集

Selected engineering work across embedded systems and mechanical design.嵌入式系統與機械設計的工程實作。

Voron 2.4 open-source design render2022 / BUILD
SYSTEM INTEGRATION系統整合

Voron 2.4 build & upgradesVoron 2.4 組裝與升級

Independent assembly and upgrades based on the Voron Design open-source project.基於 Voron Design 開源設計,獨立組裝並持續升級。

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ESP32-P4 interface schematicMCU / SCHEMATIC
EMBEDDED / HARDWARE嵌入式 / 硬件

ESP32-P4 interface designESP32-P4 接口設計

Camera, storage, audio, USB, and power circuitry.相機、儲存、音訊、USB 與電源電路。

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Quadruped mechanism CAD renderCAD / DESIGN
MECHANICAL / CAD機械 / CAD

Structural 3D design engineering結構三維設計工程

Quadruped 3D assemblies, dimensioned parts, and mechanical drawings.四足機構三維組裝、零件尺寸與機械工程圖。

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PCB layout study 01PCB / 01
PCB LAYOUTPCB 佈局

PCB layout study 01PCB 佈局研究 01

Two-sided component placement and routing.雙面器件擺位與走線設計。

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PCB layout study 02PCB / 02
PCB LAYOUTPCB 佈局

PCB layout study 02PCB 佈局研究 02

Connector placement and board-level routing.接口佈置與板級走線。

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PCB layout study 03PCB / 03
PCB LAYOUTPCB 佈局

PCB layout study 03PCB 佈局研究 03

Compact two-sided board layout.小型雙面板佈局。

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Geared mechanical assembly drawingCAD / ASSEMBLY
MECHANICAL / CAD機械 / CAD

Geared assembly study齒輪機構組裝研究

Assembly drawing with part identifiers and a parts list.附零件標識及零件表的組裝工程圖。

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WIRELESS / EMBEDDED無線通信 / 嵌入式

LoRa communication moduleLoRa 通信模塊

Led work on a long-range wireless communication module.主導遠距離無線通信模塊的開發。

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02 / TECHNICAL PROFILE技術概覽

Technical experience技術經驗

Embedded electronics, physical prototyping, and software development, with emphasis on independent learning and practical integration.涵蓋嵌入式電子、實體原型及軟件開發,重視自主學習與工程整合。

01 / EMBEDDED嵌入式

Electronics電子工程

  • MCU platformsMCU 平台ESP32 family, consumer-grade STM32 devices, and Arduino boards.ESP32 系列、常見消費級 STM32 MCU 與 Arduino 開發板。
  • STM32CubeIDEPinout, clock-tree and NVIC configuration; HAL firmware, peripherals, and on-target debugging. Detailed profile ↗引腳、時鐘樹與 NVIC 配置;HAL 韌體、外設及板上除錯。詳細內容 ↗
  • Circuit design電路設計Datasheet interpretation, non-high-speed peripheral circuits, digital circuits, and PCB design.規格書閱讀、非高速外圍電路、數字電路及 PCB 設計。
  • Components元件應用Common sensors, control ICs, and power-management ICs.常見傳感器、控制芯片與電源管理芯片。

02 / SOFTWARE軟件

Applications應用開發

  • AI systemsAI 系統Experience with AI agents, retrieval-augmented generation (RAG), and multi-agent workflows.具備 AI Agent、檢索增強生成(RAG)與多智能體工作流經驗。
  • Deployment部署Full-stack application development and cloud deployment experience.全棧應用開發與雲端部署經驗。

03 / STEMSTEM 實作

Physical platforms實體平台

  • Control & sensors控制與傳感Common STEM sensor modules and micro:bit controllers.常見 STEM 傳感器模塊與 micro:bit 控制器。
  • Robotics機器人Line-following, wheel-legged, balancing, tracked, and vision-based robots.巡線、輪足、平衡輪、履帶及視覺機器人。
  • Fabrication製作平台Quadcopter platforms and commercial or DIY 3D printers.四軸無人機平台及商用或 DIY 3D 打印機。

These are platform use and integration experiences, not claims of original design for every device.上述為平台使用與整合經驗,不代表各設備均由本人原創設計。

03 / ABOUT關於

Profile個人簡介

Electrical engineering undergraduate at City University of Hong Kong; expected graduation in 2027. My work emphasizes independent learning, prototyping, and systematic integration across hardware and software.香港城市大學電氣工程本科在讀,預計 2027 年畢業。重視自主學習、原型實作,以及硬件與軟件的系統整合。

04 / CONTACT聯絡

Contact聯絡方式

Research, employment, and engineering collaboration inquiries.科研、招聘及工程合作事宜。